HANMI Semiconductor announced on the 25th that it will invest 100 billion won in hybrid bonding technology. HANMI Semiconductor plans to release hybrid bonder equipment by the end of 2027.
HANMI Semiconductor is constructing a hybrid bonder factory in the Incheon Metropolitan City Ju-an National Industrial Complex with a total investment of 100 billion won, featuring a total floor area of 14,570.84 m2 (4,415 pyeong) with two floors above ground, aiming for completion in the second half of 2026. With this investment, HANMI Semiconductor will complete a production line of a total area of 89,530 m2 (27,083 pyeong).
The hybrid bonder factory plans to produce next-generation equipment, including high-spec HBM TC bonders, fluxless bonders, and big die TC bonders for AI 2.5D packaging, as well as hybrid bonders (for HBM / logic semiconductor XPU).
HANMI Semiconductor will also strengthen its technology development. On the 23rd, HANMI Semiconductor signed a hybrid bonder technology agreement with TES, a semiconductor equipment company. The combination of HANMI Semiconductor's bonder technology for HBM and TES's plasma, thin film deposition, and cleaning technologies is expected to enhance competitiveness. Additionally, the company plans to accelerate the speed of technology development by strengthening its R&D personnel specialized in hybrid bonders.
HANMI Semiconductor plans to supply its market-leading HBM TC bonder equipment according to its roadmap. Production of the TC BONDER 4, dedicated to HBM4, which was released in May, began this month, and the release of fluxless bonder equipment is also scheduled for this year.
A representative from HANMI Semiconductor stated, "The demand for hybrid bonding technology is essential to improve the performance of next-generation high-density HBM." He added, "With proactive investment, HANMI Semiconductor will timely supply the core equipment needed for global memory companies' next-generation HBM development to maintain market leadership."