HANMI Semiconductor announced on the 4th that it has begun production of the 'TC Bonder 4,' dedicated equipment for the next-generation AI semiconductor core memory, HBM4.
'TC Bonder 4' is new equipment released in May and will begin full-scale supply in the second half of this year. Global corporations manufacturing high-bandwidth memory (HBM) are preparing for mass production of the 6th generation HBM (HBM4) in the latter half of this year.
HANMI Semiconductor explained that the 'TC Bonder 4' has greatly improved precision compared to previous products to meet the high precision demands of HBM4 while also enhancing the structural stability of stacked HBM. Additionally, the software functions have been upgraded to improve user convenience.
HBM4 has seen a 60% improvement in speed compared to the existing 5th generation (HBM3E), while power consumption has been reduced to about 70%, resulting in significant performance enhancements. It can be stacked up to 16 layers and the capacity per DRAM has expanded from 24 gigabits (Gb) to 32 Gb. The number of silicon via (TSV) interfaces, which are data transmission channels, has doubled compared to the previous generation, increasing to 2,048, greatly enhancing the data transmission speed between processors and memory.
A representative of HANMI Semiconductor said, 'We have established a mass production system so that the 'TC Bonder 4' can respond without delay to the mass production plans of global memory corporations for HBM4,' adding, 'Through this supply of HBM4 dedicated equipment, we will maintain our leading position in the global AI semiconductor market.'
Founded in 1980, HANMI Semiconductor is a global semiconductor equipment corporation with approximately 320 customers worldwide. Since the establishment of the Intellectual Property Department in 2002, it has also focused on the protection and enhancement of intellectual property rights, filing a total of more than 120 HBM equipment patents to date. HANMI Semiconductor holds more than a 90% market share in the TC Bonder market for producing the 5th generation HBM (HBM3E) 12 layers.