HANMI Semiconductor announced on the 3rd that it will participate in the 'Advanced Packaging Bonding Corporations Conference' on July 3-4, being the only one among domestic corporations.
According to the Financial Supervisory Service's electronic disclosure system on that day, HANMI Semiconductor disclosed that it will participate in the 'Advanced Packaging Bonding Corporations Conference' on the 4th. This conference is a specialized investor event in the advanced packaging bonding equipment sector hosted by global investment bank UBS. It is an opportunity for global semiconductor equipment corporations, including HANMI Semiconductor, BESI, ASMPT, Kulicke & Soffa, and Sivaura Mechatronics, to announce their next-generation packaging technology strategies and roadmaps.
HANMI Semiconductor plans to introduce key business status and future plans at this conference, including this year's market outlook for TC bonders, next-generation TC bonders, and hybrid bonders responding to high-bandwidth memory (HBM) customer demand.
Advanced packaging technology is emerging as a core technology in the semiconductor industry alongside the rapid growth of the AI semiconductor and HBM (high bandwidth memory) markets. It is considered an essential technology for implementing chiplet-based next-generation processors and high-performance memory products.
HANMI Semiconductor plans to reveal its technological competitiveness in the global advanced packaging market through this conference. HANMI Semiconductor currently holds over 90% market share in the TC bonder market for 5th generation HBM (HBM3E) 12-tier production. HANMI Semiconductor is strengthening its market penetration by launching the 'TC Bonder 4,' a dedicated production equipment for the next-generation 6th generation HBM (HBM4) in May.