The '2025 Next-Generation Semiconductor Packaging Exhibition (ASPS)' will be held from Aug. 27 to 29 at the Suwon Convention Center. This year, a platform for interaction with Samsung Electronics, SK hynix, and NVIDIA is expected.
According to the Gyeonggi Province and Suwon City on the 29th, the '2025 Next-Generation Semiconductor Packaging Exhibition' is a showcase exhibiting advanced technologies related to semiconductor packaging, including packaging and testing process equipment, materials, components, and technology solutions.
Advanced packaging technology is a post-process that reconfigures semiconductor chips into shapes suitable for electronic devices and is being noted as an alternative to overcome the limits of ultra-fine processes.
Especially this year, the 'ISESKOREA2025' (Global Semiconductor Executive Summit, Aug. 27-28), with executives from global semiconductor corporations such as Samsung Electronics, SK hynix, NVIDIA, and ON Semiconductor in attendance, will coincide with the event, allowing local semiconductor corporations to engage directly with global companies and discuss new technologies and future directions in the advanced semiconductor industry.
As part of the event, various programs will be held, including the 'Packaging Trend Forum' introducing domestic and international semiconductor packaging trends and technology trends, technology seminars led by major industry organizations, technical briefings by exhibitors, a purchasing consultation meeting to match domestic small and medium-sized enterprises with overseas buyers, and a job fair.
Additionally, a global corporate briefing involving the Japan External Trade Organization (JETRO) and the Israeli Embassy is also scheduled, and it is expected to contribute to the expansion of international cooperation networks.