Samsung Electronics unveiled its mobile application processor (AP) 'Exynos 2500' produced using its 3nm (nanometer = one billionth of a meter) foundry process. This AP is expected to be equipped in the foldable smartphone 'Galaxy Z Flip 7' scheduled for release next month.
According to Samsung Electronics' website on the 24th, Exynos 2500 is designed by the system LSI of the device solutions (DS) institutional sector, and is manufactured by Samsung Foundry using the state-of-the-art gate-all-around (GAA) based 3nm process.
The AP is a semiconductor that functions as the brain of the smartphone. The smartphone AP made using the 3nm process is the Exynos 2500, which is the first of its kind. Last July, the wearable AP 'Exynos W1000', made with a 3nm process, was also included in the Galaxy Watch 7.
Samsung Electronics stated on its website that the Exynos 2500 is in 'mass production.' This indicates that the yield has improved enough for the chips to be produced in large quantities. The Exynos 2500 is rumored to be equipped entirely in the Galaxy Z Flip 7. Previously, Samsung Electronics has been using Qualcomm's Snapdragon chipsets in the Galaxy Flip and Fold series.
Optimized for artificial intelligence (AI) smartphones, the Exynos 2500 boasts a processing power of up to 59 trillion operations per second (TOPS), an increase of 39% over its predecessor (Exynos 2400). It also supports AI-based image processing and ultra-high-resolution cameras of up to 320MP (megapixels), as well as video recording and playback at 60 frames per second (fps) and 30 fps, respectively, at 8K resolution.