HANMI Semiconductor announced on the 5th the launch of a team named Silver Phoenix dedicated to the production of the 6th generation high bandwidth memory (HBM) equipment 'TC Bonder 4'.
Silver Phoenix was composed of over 50 skilled semiconductor equipment specialists to respond quickly to various technical requests from clients, as well as for equipment maintenance and optimization.
HANMI Semiconductor also supports 30 environmentally friendly hybrid four-wheel drive (4WD) sport utility vehicles (SUVs) to ensure that the dedicated team can provide safe and prompt premium service.
The TC Bonder is a key piece of equipment necessary for manufacturing HBM for artificial intelligence (AI) semiconductors. HBM is made by stacking multiple DRAMs, and the TC Bonder is used in the process that applies heat and pressure to stabilize the DRAM.
Earlier, HANMI Semiconductor released the 'TC Bonder 4' equipment for HBM4 in mid-May, becoming the first in the industry to do so. The 'TC Bonder 4' is specialized equipment that enables HBM4 production and is characterized by greatly improved productivity and precision compared to previous products, tailored to meet the highly precise requirements of HBM4.
Through this, it is expected to actively respond to the mass production of HBM4 by global memory manufacturers and the increasing demand for AI semiconductors from big tech corporations in the second half of this year.
Additionally, HANMI Semiconductor opened its second regional base in Icheon, Gyeonggi Province, earlier this month following the opening in Cheongju, Gyeonggi Province, last April. This aims to provide real-time responses to clients' technical requirements and customized services.
A representative from HANMI Semiconductor said, 'Through the launch of this TC Bonder 4 dedicated team Silver Phoenix, we will provide premium services and make every effort to maximize customer satisfaction.'