SK hynix and NVIDIA's negotiations for the supply of 6th generation high bandwidth memory (HBM4) 12-layer products have reportedly entered the final stages. As the release schedule and other details for NVIDIA's artificial intelligence (AI) accelerator 'Rubin platform,' which will be the first to feature HBM4, become clearer, plans to finalize the initial order quantities and final prices are also moving forward. SK hynix is accelerating its mass production preparations by planning to bring in new equipment for HBM4 production alongside the completion of the Cheongju M15x fab.
According to industry sources on the 28th, SK hynix plans to commence mass production of the HBM4 12-layer products starting in the fourth quarter of this year to supply NVIDIA. Production will begin once NVIDIA finalizes the release schedule and supply quantities for the Rubin platform. SK hynix also plans to establish a production line at the Cheongju M15x fab, which is set to be completed in the second half of this year.
SK hynix aims to strengthen its position as a leader in the HBM market by proactively supplying HBM4 12-layer products. According to market research firm Counterpoint Research, SK hynix's market share in HBM is nearing 70%. However, with Micron entering NVIDIA's 5th generation HBM (HBM3E) 8-layer supply chain, SK hynix plans to leverage advanced products like HBM4 to widen the gap. Samsung Electronics is also conducting sample testing to supply HBM3E to NVIDIA.
SK hynix has reportedly expressed confidence that it can secure an advantage in the HBM4 12-layer market. HBM4 incorporates design changes, including the initial application of foundry processes to the logic die, which acts as the brain of the chip, as well as a doubling of the number of I/O pathways for data transfer. Without its own foundry process capabilities, SK hynix entrusts the production of the logic die to TSMC.
An industry insider noted, "With HBM4, there will be a shift in product characteristics such as the emergence of a customized HBM market," emphasizing that while there may not be significant technical differences in production processes compared to HBM3E 12-layer products, SK hynix is internally confident about its ability to lead in the HBM4 market, based on its accumulated technology.
SK hynix was the first in the industry to send HBM4 samples to major clients in March, and testing has reportedly been progressing smoothly. Jensen Huang, the CEO of NVIDIA, visited the SK hynix booth at the Computex 2025, Asia's largest IT and computing exhibition held in Taipei this month, and requested, "Please support HBM4 well."
SK hynix plans to import new equipment as soon as the Cheongju M15x fab, responsible for mass production of HBM4, is completed in the second half of this year. An industry insider stated, "SK hynix is currently expanding its production capacity in line with NVIDIA's demand," adding, "It is possible that mass production could commence as early as October, so equipment orders may be placed in July or August."
However, there are concerns that the release schedule for NVIDIA's next-generation AI chip, Rubin, may be delayed. An insider familiar with SK hynix's situation mentioned, "With HBM4 and other technologies being incorporated for the first time, there are expectations for significant improvements in performance, and it is reported that the price will also be considerable," further noting, "Supply quantities will become clearer based on the demand from big tech clients and others."