The mainstream product in the high bandwidth memory (HBM) market is expected to transition from 5th generation HBM3E to 6th generation HBM4 in the second half of next year.
On the 22nd, market research firm TrendForce forecasted that total HBM shipments next year would exceed 30 billion gigabits (Gb) amid strong demand.
In particular, as memory suppliers increase production, the market share of HBM4 is steadily rising, and it is projected that HBM4 will surpass HBM3E to become the mainstream solution in the second half of 2026.
The demand for artificial intelligence (AI) servers is accelerating the development of HBM technology, and major HBM suppliers are also actively pursuing an HBM4 product roadmap.
It is likely that HBM4 will be equipped in NVIDIA's next-generation graphics processing unit (GPU) 'Rubin' and AMD's next-generation AI chip 'MI400' series.
Even as HBM4 rises to prominence, TrendForce observed that SK hynix, which currently dominates the HBM market, is expected to maintain its lead with over 50% market share.
TrendForce noted, 'Samsung Electronics and Micron need to further improve yield and production capacity to narrow the gap with SK hynix in the HBM4 competition.'
Moreover, it anticipated, 'While HBM3E was launched with a price premium of about 20%, HBM4 is expected to see premiums rise to over 30% due to increased manufacturing difficulty.'