HANMI Semiconductor announced on the 16th that it will participate in the '2025 SEMICON Southeast Asia (SEA)' exhibition, which will be held in Singapore from the 20th to the 22nd.
At this exhibition, HANMI Semiconductor will primarily showcase its TC bonder, used for producing high-bandwidth memory (HBM), which holds the number one market share in the world.
It will also promote semiconductor package equipment, such as the '7th generation new MSVP 6.0 Griffin,' which has improved precision compared to previous generations, to major global clients.
SEMIKON SEA is celebrating its 30th anniversary this year and will be held in Singapore, the hub of Southeast Asia, marking HANMI Semiconductor's first participation.
HANMI Semiconductor noted, "Through participating in SEMICON SEA, we plan to actively promote advanced equipment technology in the Southeast Asian market and further strengthen our collaborative relationships with local clients."