LX Semicon announced on the 12th that it will collaborate with Hanyang University to develop semiconductor packaging heat dissipation technology and train specialized personnel.
LX Semicon and Hanyang University recently held a research agreement ceremony at the new main building on Hanyang University's Seoul campus for the research and development of semiconductor and power semiconductor packaging heat dissipation technology and training of personnel. The ceremony was attended by Hanyang University President Gi-jeong Lee, Director of the Advanced Semiconductor Packaging Research Center Hak-seong Kim, LX Semicon CEO Yoon-tae Lee, and Executive Director Young-soo Han.
LX Semicon expects that this research will enable effective design of heat dissipation components that make up semiconductor packages and power semiconductor packages.
LX Semicon plans to focus on training specialized personnel in the semiconductor field. It intends to actively recruit master's and doctoral candidates through internships for Hanyang University's engineering students and the selection of industry-academic scholarship students.
CEO Yoon-tae Lee said, “If LX Semicon's semiconductor design capabilities and heat dissipation technology are combined with advanced semiconductor packaging technology, we expect to maximize customer value,” adding, “We will also operate a personnel training program to actively recruit excellent talent.”