Ansys announced that it has obtained certification for thermal and multiphysics verification tools for advanced semiconductor designs manufactured using Intel's 18A (1.8-nanometer) process technology.
Ansys noted that this certification plays a crucial role in ensuring the functionality and reliability of semiconductor systems used in high-end applications such as artificial intelligence (AI) semiconductors, graphics processing units (GPUs), and high-performance computing (HPC) products.
Ansys RedHawk-SC and Ansys Totem provide power integrity and reliability analysis performance based on Intel 18A's GAA (gate-all-around) transistor, RibbonFET, and the back power delivery structure, PowerVia.
Additionally, Ansys is set to join the Intel Foundry Chiplet Alliance, part of the Intel Foundry Accelerator Alliance, contributing to the establishment of a secure ecosystem for interoperable chiplet design and manufacturing.
Rick Li, vice president and general manager of Intel's Foundry Ecosystem Technology Office, said, "The multi-die assembly approach is changing the industry's perspective on chip stacking and design efficiency. Ansys's simulation will help customers validate designs with high precision and play a key role in reducing the expense of difficult-to-recover costs."
John Lee, vice president of the Electronics, Semiconductor, and Optical division at Ansys, stated, "Ansys's multiphysics simulation solutions ensure a high level of thermal, signal, power, and mechanical integrity, providing the highest level of confidence," and added, "By strengthening collaboration with Intel Foundry and joining the Chiplet Alliance, Ansys will fulfill its promise of enhancing engineering excellence through open and interoperable technologies."