Hanwha Semitec established a new semiconductor equipment development organization called the 'Advanced Packaging Equipment Development Center' and noted an increase in technical personnel on the 1st.
Hanwha Semitec explained that this organizational restructuring is aimed at responding to the surging demand for TC bonders and reflects the company's commitment to leading the global market with next-generation technology.
Earlier, Hanwha Semitec signed two supply contracts worth a total of 42 billion won for high-bandwidth memory (HBM) TC bonders with SK hynix in March.
The newly established development center plans to focus on the development of new technologies such as hybrid bonding and fluxless.
A Hanwha Semitec official said, "A new driving force has been secured to lead the next-generation HBM semiconductor equipment market," and added, "We will continue to expand our research and development investment to drive technological innovation."