TSMC has broken ground on its third semiconductor factory in Arizona, U.S.
On the 29th (local time), Bloomberg reported that TSMC has broken ground on its third factory in the U.S. as part of its expansion plans.
Howard Lutnick, U.S. Secretary of Commerce, visited the TSMC site in Arizona, which he noted is the largest single foreign investment in U.S. history, coinciding with the 100th day of Trump's second administration, and met with executives including TSMC Chairman and CEO Wei.
Last month, TSMC announced at the White House that it would invest an additional $100 billion to expand factories in order to increase production capacity in the U.S. This adds to the existing investment plan of $65 billion, ultimately constructing six advanced wafer manufacturing plants and two advanced packaging plants in the U.S.
Chairman Wei stated during the earnings announcement in April that construction of the second factory in Arizona has already been completed, and efforts are underway to accelerate the production schedule. He also mentioned that the first factory began mass production in the fourth quarter of last year at similar yield rates to those in Taiwan.
Chairman Wei added that the third and fourth plants will utilize cutting-edge N2 and A16 process technologies, and the fifth and sixth plants will also employ more advanced processes. Previously, Bloomberg reported, citing anonymous sources, that Minister Lutnick hinted that the subsidies already promised under the U.S. semiconductor law could be withheld.