Taiwan Semiconductor Manufacturing Company (TSMC), the world's largest foundry corporation, announced on the 23rd (local time) that it plans to operate a 1.4 NANO (nanometer; 1 NANO = 1 billionth of a meter) process starting in 2028. On that day, TSMC held the '2025 North America Tech Conference' in Silicon Valley, California, where it revealed its new technology roadmap.
Kevin Chang, TSMC's senior vice president, noted, “A14 (1.4 NANO) is a next-generation advanced silicon technology based on a complete process transition,” adding that it is up to 15% faster than the N2 (2 NANO process), with a 30% reduction in power consumption and a 1.23-fold increase in transistor density.
TSMC's state-of-the-art process is based on the second generation of gate-all-around (GAA) technology, which significantly enhances transistor performance and power efficiency. Additionally, chips incorporating the back-side power delivery network (BSPDN) technology, which places the power lines on the back of the wafer to simultaneously improve power efficiency and semiconductor performance, are expected to be released starting in 2029.
TSMC serves global tech giants like Apple, NVIDIA, and AMD, holding a 90% share of the advanced foundry market. The corporation plans to invest about $40 billion in capital expenditures this year and is preparing to respond to the long-term demand expansion for advanced AI semiconductors.
TSMC is building a semiconductor factory in Arizona and has begun production of NVIDIA's latest AI chip, Blackwell, while also planning to construct two more factories nearby.