SK hynix is expanding its production capacity to supply high bandwidth memory (HBM) to NVIDIA in a timely manner, and it is expected to sign an additional order contract for ‘TC bonders’ with HANMI Semiconductor, a core manufacturing equipment supplier. Although SK hynix experienced conflicts with HANMI Semiconductor while diversifying its TC bonder supply chain, it is analyzed that it will purchase HANMI Semiconductor equipment, whose technology has been proven, due to the urgent need for HBM supply.
According to industry sources on the 23rd, SK hynix is reportedly planning to place a purchase order (PO) for about 30 TC bonders as early as the first half of this year. Since the supply volume of HBM to NVIDIA has been confirmed for this year, it is analyzed that the company is rapidly expanding its production capacity. Currently, SK hynix's TC bonder suppliers include HANMI Semiconductor and Hanwha Semitech.
The TC bonder is a key piece of equipment that applies heat and pressure to connect individual DRAMs in the HBM manufacturing process, where DRAMs are stacked. It serves to stack and fix individual chips at regular intervals. SK hynix sources equipment from HANMI Semiconductor, Hanwha Semitech, and SEMES and Shinkawa from Japan. HANMI Semiconductor holds about 90% market share in the TC bonder market for HBM3E (5th generation HBM). HANMI Semiconductor, which effectively monopolized the supply of TC bonders to SK hynix, the number one company in the HBM market, reported an operating profit of 255.4 billion won last year, a 638% increase compared to the same period the previous year.
Some observers have raised concerns that additional equipment supply may become difficult as SK hynix faces friction with HANMI Semiconductor during its efforts to diversify its supply chain. To reduce its reliance on HANMI Semiconductor, SK hynix is diversifying its supply chain and has selected Hanwha Semitech, which is currently embroiled in a lawsuit with HANMI Semiconductor over TC bonder patents, as a new supplier. HANMI Semiconductor, which was providing SK hynix with maintenance (CS) services free of charge, has notified SK hynix of a price increase and has withdrawn its CS personnel.
An official in the semiconductor industry noted, “It is a basic strategy for memory manufacturing companies to diversify their equipment suppliers, but as the HBM market is rapidly growing, demand has concentrated on HANMI Semiconductor equipment that can stably mass-produce products,” adding, “When SK hynix chose Hanwha Semitech, which is embroiled in a patent lawsuit with HANMI Semiconductor, as a new supplier and started purchasing equipment at higher prices, it was unusual for HANMI Semiconductor to express complaints about it.
However, industry opinions dominate that it is virtually impossible for SK hynix, which urgently needs HBM production, to disregard HANMI Semiconductor equipment that has proven mass production capabilities. Last year, HANMI Semiconductor began supplying TC bonders not only to SK hynix but also to Micron, which started providing HBM3E products to NVIDIA. Hanwha Semitech is set to supply about 10 TC bonders starting this year, but has received evaluations indicating that its yield and productivity have yet to be proven.
An official in the semiconductor equipment industry stated, “HANMI Semiconductor has already proven its technology by supplying equipment to SK hynix and Micron, which provide HBM to NVIDIA,” and added, “Since Hanwha Semitech must now demonstrate its mass production capabilities, it is expected that HANMI Semiconductor will secure orders for more than 10 units of equipment.