As the 'logic die,' which serves as the brain of the sixth-generation high bandwidth memory (HBM4), is produced using a foundry (semiconductor contract manufacturing) process for the first time, it is reported that the test yield of logic dies produced by Samsung Electronics' foundry division is stable. There are analyses suggesting that Samsung Electronics' development and mass production of HBM4 12-layer technology, which had fallen behind in the HBM technology competition, will gain momentum.
According to the industry on the 16th, it is reported that the test production yield of the logic die produced with Samsung Electronics' 4 NANO (nanometer) process has exceeded 40%. Considering that the initial test production yield of the Baidu chip produced at the 4 NANO process was in the mid-to-high 10% range, the evaluation is positive. Jeon Young-hyun, head of the semiconductor sector at Samsung Electronics, reportedly conveyed words of encouragement regarding the foundry division's performance recently.
The foundry division has introduced a number of new processes that can improve performance while producing this logic die. An industry insider explained, "A 40% initial test production yield means that it is a favorable figure to immediately push forward with the business," adding, "Typically, foundry processes start in the 10% range and yield increases through mass production."
Samsung Electronics, which handed over leadership in the HBM3E (fifth-generation HBM) market to SK hynix and Micron, is putting all its efforts into the production of HBM4 logic dies. The HBM4 logic die applies fine foundry processes, allowing not only for enhanced chip performance but also for production tailored to the designs requested by clients, thereby flexibly responding to the rapidly growing 'custom HBM' market centered around global big tech corporations. While SK hynix and Micron need to rely on the foundry company TSMC, Samsung Electronics can leverage its own foundry technology to demonstrate its strengths.
Now, the success or failure of Samsung Electronics' HBM4 business depends on the 10 NANO-class sixth-generation (1c) DRAM being developed by its memory division. The HBM4 12-layer product will be equipped with 1c DRAM alongside the logic die. Samsung Electronics' competitor, SK hynix, is utilizing the previous generation DRAM, 1b DRAM, for HBM4, which means that if Samsung Electronics can stably mass-produce 1c DRAM, it will gain an edge in HBM4 performance.
The packaging that binds the 1c DRAM and the logic die together into a final product form is also critical. Samsung Electronics uses a different packaging method from SK hynix. Samsung Electronics employs the 'advanced thermal compression non-conductive adhesive film (TC-NCF)' technology, which lays down a film material each time chips are stacked. However, this packaging method is evaluated as having difficulties in controlling heat generation.
An industry insider noted, "Samsung Electronics has a task ahead to stabilize the DRAM used in HBM and the technology for packaging it."
Meanwhile, SK hynix, based on its HBM market share of over 70%, ascended to the throne of the DRAM market for the first time since its founding in the first quarter. According to market research firm Counterpoint Research, in the first quarter of this year, SK hynix held a 36% market share in the DRAM sector, followed by Samsung Electronics at 34%. SK hynix is producing HBM4 12-layer products and has sent samples to clients.