Rip Boo Tan, Intel CEO, is giving a keynote speech at Intel Vision 2025 held in Las Vegas, USA on Oct. 31. /Courtesy of Intel

Ripu Tan, the chief executive officer (CEO) of Intel, noted on the 31st (local time) that regaining talent lost over several years is one of Intel's current top priorities. He also expressed his determination to innovate the organizational culture by breaking down bureaucratic practices.

During the 'Intel Vision' conference held in Las Vegas that day, Tan said, "It is necessary to hire capable engineers and retain the current talent." As he appeared in public for the first time as Intel's CEO, he told attendees, including partner companies, "There is a lot to be done going forward" and acknowledged, "There are areas where we have not met your expectations."

He also admitted, "We have fallen behind in innovation" and noted, "We were too slow to adapt to changes and meet your demands." Tan emphasized, "We will simplify our work processes" and stressed the importance of breaking down bureaucracy. He added, "I have seen many cases where small, focused teams innovate swiftly and acquire existing corporations," stressing that "bureaucracy kills innovation."

Regarding why he took on the role of Intel CEO, he explained, "It was difficult to see the company struggling," and said, "I could not stand by knowing I could help." He previously served as the CEO of Cadence Design Systems, a U.S. semiconductor design software company, and he was also a member of the Intel board for about two years starting in 2022.

He reaffirmed the smooth operation of the 1.8-nanometer (18A) process in the second half of the year. He stated, "The central processing unit (CPU) applying 18A will enter mass production in the second half of the year and will be shipped within this year," adding, "We are approaching the new first external tape-out (the stage where the design is transferred to the foundry)." The 18A process is an ambitious project that Intel declared when it announced its re-entry into the foundry business in 2021. Currently, TSMC and Samsung Electronics are the only companies capable of mass-producing below 5 nanometers, and the 1.8-nanometer process is a step ahead of the 3-nanometer process that both companies are currently producing.