Lam Research announced on the 11th the launch of its etching equipment, 'Akara,' which can be applied to the three-dimensional (3D) semiconductor manufacturing process.
According to Lam Research, this etching equipment supports next-generation semiconductor manufacturing processes, including advanced dynamic random-access memory (DRAM) and 3D NAND flash memory, with foundry gate-all-around (GAA) transistors.
Lam Research explained that to enhance the performance of advanced etching equipment, it has achieved a response speed that is 100 times faster than existing materials, reducing the potential for defects during extreme ultraviolet (EUV) lithography processes. It also noted that to improve productivity and process yield, it maximizes wafer production through millisecond (ms) level fast response times and supports precise etching uniformity.
Mi Wei-je TSMC senior vice president and co-chief operating officer (COO) noted, "As semiconductor demand continues to grow, innovative technical solutions from partners are needed to develop more powerful and new semiconductor devices," adding that "plasma etching technology will play a key role in next-generation semiconductor manufacturing processes."
Lam Research added that Akara is currently being adopted as equipment by major semiconductor manufacturers in advanced DRAM and foundry GAA applications.