SK hynix has appointed Vice President Lee Woong-seon as the head of its new semiconductor packaging base being established in the United States.
According to industry sources on the 17th, SK hynix reportedly established a corporation, West Lafayette LLC, in Indiana in the third quarter of last year and appointed Vice President Lee to the position of head of the corporation.
Previously, SK hynix revealed plans to invest $3.87 billion (approximately 5.4 trillion won) in April last year to construct an advanced packaging production base for artificial intelligence (AI) memory in West Lafayette, Indiana, and to collaborate with local research institutions, including Purdue University, in semiconductor research and development. The Indiana factory is scheduled to commence mass production of next-generation high bandwidth memory (HBM) and other AI memory products starting in the second half of 2028.
Vice President Lee joined SK hynix in 2005 and has been responsible for research and development (R&D) of packaging products, wafer level packaging (WLP) manufacturing technology, and has contributed to the development and mass production of HBM.