Jensen Huang, CEO of Nvidia, who visited Taiwan, stated that the demand for advanced packaging (CoWoS) from TSMC is rapidly increasing in the era of artificial intelligence (AI). He noted that AI will become a mainstream industry and urged active investment during his visit to Taiwan.
According to Taiwanese media, including Liberty Times and United Daily News, Huang said at a visit to the new factory of semiconductor packaging company SPIL, a subsidiary of the ASE Group, the day before that "Taiwan's cooperative partners have quickly built up TSMC's increasing CoWoS production capacity."
CoWoS is an advanced packaging process that enhances processing capability by stacking graphics processing unit (GPU) and HBM chips on a single substrate while saving space and reducing power consumption. Currently, Nvidia is applying this process to produce AI semiconductors.
Huang said, "The demand for CoWoS has rapidly increased in the short term, and Taiwan's cooperative partners have quadrupled their production capacity in less than two years," adding that "the complexity of the (miniaturized) CoWoS-L manufacturing process is much higher than the previous CoWoS-S, but production capacity will continue to grow, and overall CoWoS production capacity is expected to significantly increase this year."
He stated, "Nvidia and TSMC are cooperating as foundry partners, and SPIL is an important partner for backend packaging and testing. The scale of cooperation between Nvidia and SPIL has grown 10 times compared to 10 years ago and doubled compared to last year."
He noted, "AI is related to machine learning (ML), and Nvidia's cooperative partners in Taiwan are precisely manufacturing 'AI supercomputers.' AI will become mainstream and will be applied in various fields, so Taiwan needs to invest in the AI ecosystem."
Huang, a Taiwanese-American, arrived the day before at Taichung International Airport in Taiwan after passing through China.