As demand for artificial intelligence (AI) semiconductors increases, the development of glass substrates that can significantly improve performance is accelerating. Notably, at the world's largest IT exhibition 'CES 2025' held in Las Vegas, USA, more advanced glass substrate technology was unveiled, and transactions among large corporations are taking place, leading to expectations that the era of glass substrates will arrive earlier than initially anticipated.
According to market research firm MarketsandMarkets on the 16th, the glass substrate market size is projected to grow about 18%, from $7.1 billion in 2023 to $8.4 billion in 2028. The projection gains strength that high-performance memory, along with semiconductor packages such as GPU (graphics processing unit) and CPU (central processing unit), will be needed for the efficient processing of large-scale big data in the AI era.
◇ “Elimination of heat risk, miniaturization, and advanced microprocessing”
Glass substrates refer to a technology that replaces organic materials such as conventional plastics with glass in semiconductor substrates. Theoretically, this has the advantage of reducing the chip packaging thickness to as low as one-fourth. This practically accelerates semiconductor microprocessing by about one to two generations. It is similar to implementing a 3-nanometer chip using a 7-nanometer (NANO) chip.
Using glass substrates significantly reduces pattern distortion due to the rising temperature of chips. This means they are much more resistant to heat. Heat is the biggest enemy of semiconductors. Additionally, improved flatness for enhancing the depth of extremely fine lithography processes and the feasibility of ultra-large form factor packaging will increase yields. Experts diagnose that this distinctive characteristic could raise interconnect density in glass substrates by ten times.
Glass substrates are also considered the most suitable technology for the application of chiplet packaging, which is seen as a future technology in the semiconductor market. Chiplets allow for different types and various functions of chips to be freely attached to a single chip like LEGO, achieving both energy efficiency and high-performance chips. Once glass substrates are commercialized, chip designers will be able to mount more tiles (or chiplets) in a smaller space within a single package, while also achieving enhanced performance and integration with greater flexibility and lower power consumption.
◇ Intel is joined by Samsung, LG, and SK... commercialization accelerates
The first semiconductor corporation to dive into the development of glass substrate technology was Intel. Last year, Rahul Manepalli, Intel Fellow, noted that “by 2030, semiconductors using conventional organic material substrates are likely to reach their limits in extending transistors. Organic materials have limitations such as power efficiency and warping and shrinking.” He mentioned, “Scalability is critical for the development and evolution of the semiconductor industry, and glass substrates are a viable and essential step in realizing next-generation semiconductors.”
Manepalli emphasized that “Intel's research and development (R&D) on glass substrates has been in full swing for the past 10 years.” This indicates that the technology has been in preparation since the 2010s. Intel has established a $1 billion glass R&D line at its Arizona plant and has created a close collaborative ecosystem with key partners. Through this, Intel has also conceived over 600 inventions related to glass substrates, covering architecture, processes, and equipment.
Domestic corporations are also entering the competition. SKC showcased its glass substrate at CES 2025. This substrate reportedly offers data processing speeds that are 40% faster and reduces power consumption and package thickness by more than half compared to existing substrates. It is said that applying glass substrates in AI data centers can drastically reduce the area and power consumption of those centers.
Choi Tae-won, chairman of SK Group, expressed confidence on the 8th while holding up a glass substrate made by SKC, saying, “I just sold this.” Experts believe that SKC's glass substrate has reached a commercializable level and is likely to supply major corporations such as Nvidia.
Samsung Electro-Mechanics and LG Innotek are also accelerating their glass substrate businesses. Moon Hyung-soo, CEO of LG Innotek, stated on the 8th at CES 2025 regarding glass substrates, “This is an absolute direction we must take, and LG Innotek will begin pilot production by investing in equipment from the end of this year.” He then added, “Glass substrates will start being used in communication semiconductors in 2 to 3 years and will be primarily used for servers in 5 years.” Samsung Electro-Mechanics is also conducting sample promotions for clients after establishing a pilot line at the Sejong plant, with mass production expected to commence after 2027.