Hanwha Semiconductor sent a written notice to HANMI Semiconductor demanding the cessation of the distribution of false information related to its semiconductor equipment.
According to industry sources on 28th, Hanwha Semiconductor recently appointed the Law firm BKL(Bae, Kim & Lee) to send a written notice to an executive of HANMI Semiconductor, Mr. A, demanding the immediate cessation of the distribution of false information and corrections. They also included a stance that legal actions would be taken if the dissemination of false information did not stop.
Mr. A is said to have stated during an appearance on an economic broadcast in March that a photo of the 'Thermal Compression Bonding Equipment (TC Bonder)' officially distributed by Hanwha Semiconductor was actually 'not a TC Bonder but a flip chip bonder.' Hanwha Semiconductor claims that he also disseminated false information regarding the development personnel and experience.
Previously, HANMI Semiconductor filed a lawsuit for an injunction against infringement and damages in December last year, claiming that Hanwha Semiconductor infringed on its patent for the TC Bonder equipment. As Hanwha Semiconductor has submitted a relevant response to the court, the lawsuit's hearings are expected to take place within a few days.
The TC Bonder is a device used for joining chips and substrates under high temperature and pressure in the semiconductor packaging process and plays a crucial role in manufacturing high-bandwidth memory (HBM).
HANMI Semiconductor has been supplying TC Bonders exclusively to SK hynix. However, with SK hynix recently entering into a 420 billion won supply contract for TC Bonders for HBM with Hanwha Semiconductor, the conflict between HANMI Semiconductor and Hanwha Semiconductor is intensifying.