Hanwha Semiconductor has sent a cease and desist letter to HANMI Semiconductor regarding the dissemination of false information related to its semiconductor equipment.
According to industry sources on the 28th, Hanwha Semiconductor recently appointed a law firm, Pacific, to send a cease and desist letter to HANMI Semiconductor executive A, demanding an immediate halt to the dissemination of false information and a correction notice. The letter also included a statement that legal action would be pursued if the dissemination of false information did not stop.
A is reported to have appeared on an economic broadcast in March and stated regarding the photograph of the 'thermal compression bonding equipment (TC bonder)' officially released by Hanwha Semiconductor that it was 'not a TC bonder, but a flip chip bonder.' Hanwha Semiconductor claims that A also spread false information regarding the development personnel and experience.
Previously, HANMI Semiconductor filed a lawsuit for an injunction against Hanwha Semiconductor, claiming that it infringed on the patent for the TC bonder equipment developed by HANMI Semiconductor in December of last year. Since Hanwha Semiconductor has submitted a relevant response to the court, the litigation is expected to take place within a few days.
The TC bonder is a piece of equipment that joins chips and substrates at high temperature and pressure during the semiconductor packaging process and plays a crucial role in the manufacturing of high bandwidth memory (HBM).
HANMI Semiconductor has been the exclusive supplier of TC bonders to SK hynix. However, recently SK hynix has begun diversifying its equipment supply chain by signing a supply contract for TC bonders for HBM worth 42 billion won with Hanwha Semiconductor, escalating the conflict between HANMI Semiconductor and Hanwha Semiconductor.