HANMI Semiconductor has postponed its investor relations (IR) meeting to after the earnings announcement date of May 15. This is interpreted as being due to the recent conflict with SK hynix.
According to the Financial Supervisory Service, HANMI Semiconductor canceled the IR schedule originally set for April 22 on the 18th. HANMI Semiconductor plans to resume the IR after the earnings announcement date of May 15. A representative from HANMI Semiconductor noted, "It is scheduled to be held at the end of May."
The postponement of the IR schedule occurred right after a supply conflict over the 'thermal compression (TC)' bonder, a key equipment for high bandwidth memory (HBM).
Since 2017, HANMI Semiconductor has been supplying TC bonders exclusively to SK hynix for eight years. However, conflicts arose recently as SK hynix signed a supply contract for TC bonders with Hanwha Semiconductor. HANMI Semiconductor has filed a lawsuit against Hanwha Semiconductor for technology leakage and patent infringement.
The TC bonder is equipment that applies heat and pressure to bond DRAM during the HBM production process. The TC bonder is considered one of the core pieces of equipment that determine the quality of HBM.