Doosan Enerbility announced on the 30th that it has signed a memorandum of understanding (MOU) with the semiconductor equipment specialist WONIK IPS for the exchange of metal additive manufacturing (AM) technology and joint research.
Through this MOU, the two companies plan to conduct performance evaluations of AM manufacturing parts applicable to next-generation chemical deposition equipment and design and produce prototype samples for verification. They will also collaborate on revising quality documents suitable for metal AM quality control standards.
AM is a technology that manufactures metal components by stacking metal powders layer by layer, also known as 3D printing. According to AM Research, a market research firm specializing in AM, the global AM market in the semiconductor sector is projected to grow from approximately 230 billion won in 2024 to about 2 trillion won by 2032, with an annual growth rate of over 26%.
The signing ceremony held on the 28th at the Doosan Tower in Bundang, Seongnam, Gyeonggi Province, was attended by Lee Hee-beom, head of strategy and innovation at Doosan Enerbility, and Lee Myung-beom, head of the advanced development division at WONIK IPS.
Song Yong-jin, head of the strategy and innovation institutional sector at Doosan Enerbility, noted, "As the application areas of AM expand beyond existing gas turbines and defense to semiconductors, we will actively venture into market development."